Draft:European Semiconductor Manufacturing Company
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The European Semiconductor Manufacturing Company (ESMC) is a planned joint venture between Taiwan Semiconductor Manufacturing Company (TSMC) and multiple European semiconductor companies. The site is being built in the north of Dresden and is set to be finished in 2027.[1]
Project
[edit]In August 2023, TSMC announced the construction of a semiconductor factory in Dresden as part of a joint venture. Bosch, Infineon and NXP Semiconductors will each have a 10% stake in the venture. The fab will be operated by TSMC once finished[2]. The investment sum is around 10 billion euros, half of which comes in the form of subsidies from the German government's Climate and Transformation Fund[3][4]. The plan is to manufacture chips with TSMC’s 28/22 nanometer planar CMOS and 16/12 nanometer FinFET processes. The monthly output is planned to be 40,000 wafers at a diameter of 300 mm, and an estimated 2000 people will be employed by the joint venture.
On August 20, 2024, Che Chia Wei (CEO of TSMC), Ursula von der Leyen (President of the EU Commission), Olaf Scholz (Federal Chancellor), Michael Kretschmer (Minister President of Saxony), Dirk Hilbert (Lord Mayor of Dresden), Stefan Asenkerschbaumer (Chairman of the Supervisory Board at Bosch), Jochen Hanebeck (CEO of Infineon) and Maarten Dirkzwager (Deputy President and Chief Strategist at NXP) held a ceremony to break ground. The start of production is scheduled for fall 2027[6].
References
[edit]- ^ Shilov, Anton (2024-08-22). "TSMC's joint European venture, ESMC, breaks ground on German fab". Tom's Hardware. Retrieved 2024-10-13.
- ^ "10,000 Million Euros: Semiconductor Manufacturer TSMC Invests in Dresden". Wirtschaftsförderung Sachsen. Retrieved 2024-10-13.
- ^ "Microchip site in Dresden, von der Leyen: Endorsement". 2024-08-20. Retrieved 2024-10-13.
- ^ "Commission approves €5 billion German State aid measure to support ESMC in setting up a new semiconductor manufacturing facility". European Commission - European Commission. Retrieved 2024-10-13.