Vinyltriethoxysilane
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Names | |
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Preferred IUPAC name
Ethenyltri(ethoxy)silane | |
Other names
Triethoxyvinylsilane
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Identifiers | |
3D model (JSmol)
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ChemSpider | |
ECHA InfoCard | 100.000.984 |
PubChem CID
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UNII | |
CompTox Dashboard (EPA)
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Properties | |
C8H18O3Si | |
Molar mass | 190.31 |
Appearance | Colorless liquid |
Density | 0.903 g/cm3 |
Boiling point | 160–161 °C (320–322 °F; 433–434 K) |
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa).
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Vinyltriethoxysilane is an organosilicon compound with the formula (C2H5O)3SiCH=CH2. It is a colorless liquid. The compound is bifunctional, featuring both a vinyl group and hydrolytically sensitive ethoxysilyl groups. As such it is a crosslinking agent.[1]
Applications
[edit]Vinyltriethoxysilane and the related vinyltrimethoxysilane are used as monomers and comonomer for polymers such as ethylene-vinyltrimethoxysilane and ethylene-vinyl acetate-vinyltrimethoxysilane. Vinyltrialkoxysilanes are also used as cross-linking agents during the manufacture of cross-linked polyethylene (PEX). The alkoxysilane moiety is reactive toward water, and in the presence of moisture, it forms silicon-oxygen-silicon bonds that cross-link the material to cure it. Moisture-curable polymers are used as electrical insulation in some kinds of cables and for water pipe in under-floor heating installations.
Vinyltrialkoxysilanes are also used as a coupling agents or adhesion promoters for treatment of glass fibers and particulate minerals in order to form stronger bonds with resin and produce fiberglass with better mechanical properties. Amino-functional silanes such as (3-aminopropyl)triethoxysilane and epoxy-functional silanes are used for the same purpose. The silane group attaches to the glass substrate via covalent Si-O-Si bond, while the resin reacts with the vinyl-, amino-, or epoxy- group and binds to it.
References
[edit]- ^ Wolff, Siegfried (1996). "Chemical Aspects of Rubber Reinforcement by Fillers". Rubber Chemistry and Technology. 69 (3): 325–346. doi:10.5254/1.3538376.