User:Tegel/Books/SMD2
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- Ball grid array
- Integrated circuit
- Dual in-line package
- Surface-mount technology
- Small-outline integrated circuit
- Thin small-outline package
- Shrink Small-Outline Package
- Die (integrated circuit)
- Printed circuit board
- JEDEC
- SMT placement equipment
- Chip scale package
- Wafer (electronics)
- Reflow soldering
- Solder
- TSSOP
- Solder paste
- Screen-printing
- Soldering
- Electronic component
- Wave soldering
- Through-hole technology
- Flip chip
- Chip carrier
- Flux (metallurgy)
- Restriction of Hazardous Substances Directive
- Tin
- Lead
- Whisker (metallurgy)
- Electronics