Henning Braunisch
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Henning Braunisch is an electrical engineer who works for Intel. Braunisch was named a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2016[1] for his contributions to high-bandwidth microprocessor packaging.
References
[edit]- ^ "2016 elevated fellow" (PDF). IEEE Fellows Directory. Archived from the original (PDF) on 2016-01-14. Retrieved 2017-04-08.
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