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Zen 3

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AMD Zen 3
General information
LaunchedNovember 5, 2020; 4 years ago (November 5, 2020)
Designed byAMD
Common manufacturers
CPUID codeFamily 19h
Cache
L1 cache64 KB (per core):
  • 32 KB instructions
  • 32 KB data
L2 cache512 KB (per core)
L3 cache
  • 32 MB (per CCD)
  • 96 MB (per CCD with 3D V-Cache)
  • 16 MB (in APUs)
Architecture and classification
Technology node
Instruction setAMD64 (x86-64)
Physical specifications
Transistors
  • 6.24 billion (1× CCD) or
    10.39 billion (2× CCD)
    (4.15 billion per 7 nm 8-core "CCD" & 2.09 billion for the 12 nm "I/O die")[1]
Cores
    • Desktop: 4 to 16
    • Workstation: 16 to 64
    • Server: 16 to 64
Package
  • Package FP6
Sockets
Products, models, variants
Product code names
  • Desktop
    • Vermeer (w/o iGPU)
    • Cézanne (APU)
    • Chagall

  • Thin & Light Mobile
    • Cézanne
    • Barcelo
    • Barcelo-R

  • High-End Mobile
    Cézanne
  • Server
    • Milan
    • Milan-X

History
PredecessorZen 2
Successors
Support status
Supported

Zen 3 is the name for a CPU microarchitecture by AMD, released on November 5, 2020.[2][3] It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips.[4] Zen 3 powers Ryzen 5000 mainstream desktop processors (codenamed "Vermeer") and Epyc server processors (codenamed "Milan").[5][6] Zen 3 is supported on motherboards with 500 series chipsets; 400 series boards also saw support on select B450 / X470 motherboards with certain BIOSes.[7] Zen 3 is the last microarchitecture before AMD switched to DDR5 memory and new sockets, which are AM5 for the desktop "Ryzen" chips alongside SP5 and SP6 for the EPYC server platform and sTRX8.[3] According to AMD, Zen 3 has a 19% higher instructions per cycle (IPC) on average than Zen 2.

On April 1, 2022, AMD released the new Ryzen 6000 series for laptops/mobile, using an improved Zen 3+ architecture featuring notable architectural improvements to power efficiency and power management.[8] And slightly later, on April 20, 2022, AMD would also release the Ryzen 7 5800X3D desktop processor, which increased gaming performance by around +15% on average by using for the very first time in a PC product, a 3D vertically stacked L3 cache. Specifically in the form of a 64MB L3 cache "3D V Cache" die made on the same TSMC N7 process as the 8-core Zen 3 CCD which it gets direct copper to copper hybrid bonded to.[9]

Features

[edit]

As the first largely "ground up redesign" of the Zen CPU core since the architecture family's original release in early 2017 with Zen 1/Ryzen 1000, Zen 3 was a significant architectural improvement over its predecessors; having a very significant IPC increase of +19% over the prior Zen 2 architecture in addition to being capable of reaching higher clock speeds.[10]

Like Zen 2, Zen 3 is composed of up to 2 core complex dies (CCD) along with a separate IO die containing the I/O components. A Zen 3 CCD is composed of a single core complex (CCX) containing 8 CPU cores and 32 MB of shared L3 cache, this is in contrast to Zen 2 where each CCD is composed of 2 CCX, each containing 4 cores paired with 16 MB of L3 cache. The new configuration allows all 8 cores of the CCX to directly communicate with each other and the L3 Cache instead of having to use the IO die through the Infinity Fabric.[10]

Zen 3 (along with AMD's RDNA2 GPUs) also implemented Resizable BAR, an optional feature introduced in PCIe 2.0, that was branded as Smart Access Memory (SAM). This technology allows CPU to directly access all of compatible video card's VRAM.[11] Intel and Nvidia have since implemented this feature as well.[12]

  • A de-lidded Ryzen 5 5600X. Only one 6-core CCD is present. The contacts for a second CCD are visible.
    A de-lidded Ryzen 5 5600X. Only one 6-core CCD is present. The contacts for a second CCD are visible.
  • Close-up of the CCD, taken under infrared lighting. This die was damaged by the de-lidding process.
    Close-up of the CCD, taken under infrared lighting. This die was damaged by the de-lidding process.
  • Close-up of the I/O die
    Close-up of the I/O die

In Zen 3, a single 32MB L3 cache pool is shared among all 8 cores in a chiplet, vs. Zen 2's two 16MB pools each shared among 4 cores in a core complex, of which there were two per chiplet. This new arrangement improves the cache hit rate as well as performance in situations that require cache data to be exchanged among cores, but increases cache latency from 39 cycles in Zen 2 to 46 clock cycles and halves per-core cache bandwidth, although both problems are partially mitigated by higher clock speeds. Total cache bandwidth on all 8 cores combined remains the same due to power consumption concerns. L2 cache capacity and latency remain the same at 512KB and 12 cycles. All cache read and write operations are done at 32 bytes per cycle.[13]

On April 20, 2022, AMD released the R7 5800X3D. It features, for the first time in a desktop PC product, 3D-stacked vertical L3 cache. Its extra 64MB comes via a TSMC N7 (7nm) "3D V Cache" die direct copper to copper hybrid bonded right on top of the 8-core Zen 3 CCD's usual 32MB, increasing the CPU's total L3 cache capacity to 96MB and bringing significant performance improvements for gaming in particular; now rivalling contemporary high-end consumer processors while being much more power efficient and running on older, cheaper motherboards using affordable DDR4 memory.[9] And despite now spanning multiple dies and being three times larger (96MB vs 32MB), the L3 cache's performance remains nearly identical; with X3D only adding around ≈+2ns via an additional three to four cycles of latency.[14] It would later be followed by the Ryzen 5 5600X3D and Ryzen 7 5700X3D for lower-end market segments, and succeeded by the Ryzen 7000X3D family of 3D V Cache equipped Zen 4 processors on the newer socket AM5 platform.

Improvements

[edit]
CCD layouts comparison for Zen 2 and Zen 3

Zen 3 has made the following improvements over Zen 2:[13][15]

  • An increase of 19% in instructions per clock
  • The base core chiplet has a single eight-core complex (versus two four-core complexes in Zen 2)
  • A unified 32MB L3 cache pool equally available to all 8 cores in a chiplet, vs Zen 2's two 16MB pools each shared among 4 cores in a core complex.
    • On mobile: A unified 16MB L3
  • A unified 8-core CCX (from 2x 4-core CCX per CCD)
  • Increased branch prediction bandwidth. L1 branch target buffer size increased to 1024 entries (vs 512 in Zen 2)
  • New instructions
  • Improved integer units
    • 96 entry integer scheduler (up from 92)
    • 192 entry physical register file (up from 180)
    • 10 issue per cycle (up from 7)
    • 256 entry reorder-buffer (up from 224)
    • fewer cycles for DIV/IDIV ops (10...20 from 16...46)
  • Improved floating point units
    • 6 μOP dispatch width (up from 4)
    • FMA latency reduced by 1 cycle (down from 5 to 4)
  • Additional 64MB 3D vertically stacked dense library L3 cache (in -X3D models)

Feature tables

[edit]

CPUs

[edit]

APUs

[edit]

APU features table

Products

[edit]
AMD Ryzen 7 5800X

On October 8, 2020, AMD announced four Zen 3-based desktop Ryzen processors, consisting of one Ryzen 5, one Ryzen 7, and two Ryzen 9 CPUs and featuring between 6 and 16 cores.[2]

Desktop CPUs

[edit]

The Ryzen 5000 series desktop CPUs are codenamed Vermeer. The models in the second table are based on Cezanne APUs with the integrated GPU disabled. Meanwhile the Ryzen Threadripper Pro 5000 series were codenamed Chagall.

Common features of Ryzen 5000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • L1 cache: 64 KB per core (32 KB data + 32 KB instruction).
  • L2 cache: 512 KB per core.
  • Fabrication process: TSMC 7FF.
Branding and model Cores
(threads) 		Thermal
solution 		Clock rate (GHz) L3 cache
(total) 		TDP Chiplets Core
config[i] 		Release
date 		MSRP
Base Boost
Ryzen 9 5950X 16 (32) — 3.4 4.9 64 MB 105 W 2 × CCD
1 × I/OD 		2 × 8 Nov 5, 2020 US $799
5900XT 3.3 4.8 Jul 31, 2024 US $349
5900X 12 (24) 3.7 2 × 6 Nov 5, 2020 US $549
5900 3.0 4.7 65 W Jan 12, 2021 OEM
PRO 5945 Sep 2022[16]
Ryzen 7 5800X3D 8 (16) 3.4 4.5 96 MB 105 W 1 × CCD
1 × I/OD 		1 × 8 Apr 20, 2022 US $449
5800XT Wraith Prism 3.8 4.8 32 MB Jul 31, 2024 US $249
5800X — 4.7 Nov 5, 2020 US $449
5800 3.4 4.6 65 W Jan 12, 2021 OEM
5700X3D 3.0 4.1 96 MB 105 W Jan 31, 2024[17] US $249
5700X 3.4 4.6 32 MB 65 W Apr 4, 2022 US $299
PRO 5845 Sep 2022 OEM
Ryzen 5 5600X3D 6 (12) 3.3 4.4 96 MB 105 W 1 × 6 Jul 7, 2023
US Only[18] 		US $229[19]
5600XT Wraith Stealth 3.7 4.7 32 MB 65 W Oct 31, 2024 US $194[20]
5600X 3.7 4.6 Nov 5, 2020 US $299
5600T 3.5 4.5 Oct 31, 2024 US $186[20]
5600 3.5 4.4 Apr 4, 2022 US $199
PRO 5645 — 3.7 4.6 Sep 2022 OEM
  1. ^ Core Complexes (CCX) × cores per CCX

Common features of Ryzen 5000 (Cezanne) desktop CPUs:

  • Socket: AM4.
  • CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
Branding and model Cores
(threads) 		Thermal
solution 		Clock rate (GHz) L3 cache
(total) 		TDP Core
config[i] 		Release
date 		MSRP
(USD)
Base Boost
Ryzen 7 5700[21] 8 (16) Wraith Stealth 3.7 4.6 16 MB 65 W 1 × 8 Apr 4, 2022 (OEM),
Dec 21, 2023 (retail) 		$179
Ryzen 5 5500 6 (12) 3.6 4.2 1 × 6 Apr 4, 2022 $159
Ryzen 3 5100[22][23][24] 4 (8) – 3.8 8 MB 1 × 4 2023 OEM
  1. ^ Core Complexes (CCX) × cores per CCX

5100, 5500, and 5700 have no ECC support like non-Pro Ryzen 5000 Desktop APUs.

Common features of Ryzen 5000 workstation CPUs:

  • Socket: sWRX8.
  • All the CPUs support DDR4-3200 in octa-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
Branding and Model Cores
(threads) 		Clock rate (GHz) L3 cache
(total) 		TDP Chiplets Core
config[i] 		Release
date 		MSRP
Base Boost
Ryzen
Threadripper
PRO 		5995WX 64 (128) 2.7 4.5 256 MB 280 W 8 × CCD
1 × I/OD 		8 × 8 Mar 8, 2022
(OEM) /
?
(retail) 		OEM /
US $6500
5975WX 32 (64) 3.6 128 MB 4 × CCD
1 × I/OD 		4 × 8 Mar 8, 2022
(OEM) /
?
(retail) 		OEM /
US $3300
5965WX 24 (48) 3.8 4 × 6 Mar 8, 2022
(OEM) /
?
(retail) 		OEM /
US $2400
5955WX 16 (32) 4.0 64 MB 2 × CCD
1 × I/OD 		2 × 8 Mar 8, 2022 OEM
5945WX 12 (24) 4.1 2 × 6
  1. ^ Core Complexes (CCX) × cores per CCX

Desktop APUs

[edit]

Cezanne

[edit]

Common features of Ryzen 5000 desktop APUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: TSMC 7FF.
Branding and model CPU GPU[a] Thermal
solution 		TDP Release
date 		MSRP
Cores
(threads) 		Clock rate (GHz) L3 cache
(total) 		Core
config[i] 		Clock
(MHz) 		Config[ii] Processing
power[iii]
(GFLOPS)
Base Boost
Ryzen 7 5700G[b] 8 (16) 3.8 4.6 16 MB 1 × 8 2000 512:32:8
8 CU 		2048 Wraith Stealth 65 W Apr 13, 2021 (OEM),
Aug 5, 2021 (retail) 		US $359
5700GE[b] 3.2 35 W Apr 13, 2021 OEM
Ryzen 5 5600GT 6 (12) 3.6 1 × 6 1900 448:28:8
7 CU 		1702.4 65 W Jan 31, 2024[25] US $140
5600G[b] 3.9 4.4 Apr 13, 2021 (OEM),
Aug 5, 2021 (retail) 		US $259
5600GE[b] 3.4 35 W Apr 13, 2021 OEM
5500GT 3.6 65 W Jan 31, 2024[25] US $125
Ryzen 3 5300G[b] 4 (8) 4.0 4.2 8 MB 1 × 4 1700 384:24:8
6 CU 		1305.6 OEM Apr 13, 2021 OEM
5300GE[b] 3.6 35 W
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  2. ^ a b c d e f Model also available as PRO version as 5350GE,[26] 5350G,[27] 5650GE,[28] 5650G,[29] 5750GE,[30] 5750G,[31] released June 1, 2021.[32]

Mobile APUs

[edit]

Cezanne

[edit]
Branding and Model CPU GPU TDP Release
date
Cores
(Threads) 		Clock rate (GHz) L3 cache
(total) 		Core
config[i] 		Model Clock
(GHz) 		Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 5980HX[33] 8 (16) 3.3 4.8 16 MB 1 × 8 Radeon
Graphics
[a] 		2.1 512:32:8
8 CUs 		2150.4 35–54 W Jan 12, 2021
5980HS[34] 3.0 35 W
5900HX[35] 3.3 4.6 35–54 W
5900HS[36] 3.0 35 W
Ryzen 7 5800H[37][38] 3.2 4.4 2.0 2048 35–54 W
5800HS[39] 2.8 35 W
5800U[note 1][40] 1.9 10–25 W
Ryzen 5 5600H[41][42] 6 (12) 3.3 4.2 1 × 6 1.8 448:28:8
7 CUs 		1612.8 35–54 W
5600HS[43] 3.0 35 W
5600U[note 1][44] 2.3 10–25 W
5560U[45] 4.0 8 MB 1.6 384:24:8
6 CUs 		1228.8
Ryzen 3 5400U[note 1][46][47] 4 (8) 2.7 4.1 1 × 4
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d Model also available as PRO version as 5450U,[48] 5650U,[49] 5850U,[50] released on March 16, 2021.

Barceló

[edit]
Branding and model CPU GPU TDP Release
date
Cores
(Threads) 		Clock rate (GHz) L3 cache
(total) 		Core
config[i] 		Model Clock
(GHz) 		Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 5825U[note 1][note 2][51] 8 (16) 2.0 4.5 16 MB 1 × 8 Radeon
Graphics[a] 		2.0 512:32:8
8 CUs 		2048 15 W Jan 4, 2022
Ryzen 5 5625U[note 1][note 2][52] 6 (12) 2.3 4.3 1 × 6 1.8 448:28:8
7 CUs 		1612.8
Ryzen 3 5125C[53] 2 (4) 3.0 — 8 MB 1 × 2 ? 192:12:8
3 CU 		? May 5, 2022
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c Model also available as Pro version as 5475U,[54] 5675U,[55] 5875U,[56] released on April 19, 2022.
  2. ^ a b c Model also available as Chromebook optimized version as 5425C,[57] 5625C,[58] 5825C,[59] released on May 5, 2022.

Barceló-R

[edit]

Common features of Ryzen 7030 notebook APUs:

  • Socket: FP6.
  • All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 3.0 lanes.
  • Native USB 4 (40Gbps) Ports: 0
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: TSMC N7 FinFET.
Branding and Model CPU GPU TDP Release
date
Cores
(threads) 		Clock rate (GHz) L3 cache
(total) 		Core
config[a] 		Model Clock
(GHz) 		Processing
power[b]
(GFLOPS)
Base Boost
Ryzen 7 (PRO) 7730U 8 (16) 2.0 4.5 16 MB 1 × 8 Vega
8 CU 		2.0 2048 15 W January 4, 2023
[60]
Ryzen 5 (PRO) 7530U 6 (12) 1 × 6 Vega
7 CU 		1792
Ryzen 3 (PRO) 7330U 4 (8) 2.3 4.3 8 MB 1 × 4 Vega
6 CU 		1.8 1382.4
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Embedded CPUs

[edit]
Model Release
date 		Fab CPU Socket PCIe
support 		Memory
support 		TDP
Cores
(threads) 		Clock rate (GHz) Cache
Base Boost L1 L2 L3
V3C14[61][62] September 27, 2022[63] TSMC
7FF 		4 (8) 2.3 3.8 32 KB inst.
32 KB data
per core 		512 KB
per core 		8 MB FP7r2 20
(8+4+4+4)
PCIe 4.0 		DDR5-4800
dual-channel 		15 W
V3C44[61][62] 3.5 3.8 45 W
V3C16[61][62] 6 (12) 2.0 3.8 16 MB 15 W
V3C18I[61][62] 8 (16) 1.9 3.8 15 W
V3C48[61][62] 3.3 3.8 45 W

Server CPUs

[edit]

The Epyc server line of chips based on Zen 3 is named Milan and is the final generation of chips using the SP3 socket.[6] Epyc Milan was released on March 15, 2021.[64]

Common features:

  • SP3 socket
  • Zen 3 microarchitecture
  • TSMC 7 nm process for the compute and cache dies, GloFo 14 nm process for the I/O die
  • MCM with one I/O Die (IOD) and multiple Core Complex Dies (CCD) for compute, one core complex (CCX) per CCD chiplet
  • Eight-channel DDR4-3200
  • 128 PCIe 4.0 lanes per socket, 64 of which are used for Infinity Fabric in 2P platforms
  • 7003X series models include 64 MiB L3 cache dies stacked on top of the compute dies (3D V-Cache)
  • 7003P series models are restricted to uniprocessor operation (1P)
Model Cores
(threads) 		Chiplets Core
config
[i] 		Clock rate Cache Socket Scaling TDP
default (range) 		Release
price
Base
(GHz) 		Boost
(GHz) 		L2
(per core) 		L3
(per CCX) 		Total
7203(P)   8 (16) 2 + IOD  2 × 4  2.8  3.4  512 KiB 32 MiB 68 MiB   SP3 2P (1P) 120 W (120-150)   $348 ($338)
72F3 8 + IOD  8 × 1  3.7  4.1 260 MiB 2P 180 W (165-200) $2468
7303(P) 16 (32) 2 + IOD  2 × 8  2.4  3.4 32 MiB 72 MiB 2P (1P) 130 W (120-150)   $604 ($594)
7313(P) 4 + IOD  4 × 4  3.0  3.7 136 MiB 2P (1P) 155 W (155-180) $1083 ($913)
7343  3.2  3.9 2P 190 W (165-200) $1565
73F3 8 + IOD  8 × 2  3.5  4.0 264 MiB 240 W (225-240) $3521
7373X 8* + IOD  3.05  3.8 96 MiB 776 MiB 240 W (225-280) $4185
7413 24 (48) 4 + IOD  4 × 6  2.65  3.6 32 MiB 140 MiB 2P 180 W (165-200) $1825
7443(P)  2.85  4.0 2P (1P) 200 W (165-200) $2010 ($1337)
74F3 8 + IOD  8 × 3  3.2  4.0 268 MiB 2P 240 W (225-240) $2900
7473X 8* + IOD  2.8  3.7 96 MiB 780 MiB 240 W (225-280) $3900
7453 28 (56) 4 + IOD  4 × 7  2.75  3.45 16 MiB 78 MiB 2P 225 W (225-240) $1570
7513 32 (64) 8 + IOD  8 × 4  2.6  3.65 16 MiB 144 MiB 2P 200 W (165-200) $2840
7543(P)  2.8  3.7 32 MiB 272 MiB 2P (1P) 225 W (225-240) $3761 ($2730)
75F3  2.95  4.0 2P 280 W (225-280) $4860
7573X 8* + IOD  2.8  3.6 96 MiB 784 MiB $5590
7R13[65] 48 (96) 6 + IOD  6 × 8  TBD  3.7 32 MiB 216 MiB TBD TBD OEM/AWS
7643(P) 8 + IOD  8 × 6  2.3  3.6 280 MiB 2P (1P) 225 W (225-240) $4995 ($2722)
7663 56 (112)  8 × 7  2.0  3.5 32 MiB 284 MiB 2P 240 W (225-240) $6366
7663P 1P 240 W (225-280) $3139
7713(P) 64 (128)  8 × 8  2.0  3.675 32 MiB 288 MiB 2P (1P) 225 W (225-240) $7060 ($5010)
7763  2.45  3.4 2P 280 W (225-280) $7890
7773X 8* + IOD  2.2  3.5 96 MiB 800 MiB $8800
  1. ^ Core Complexes (CCX) × cores per CCX

Zen 3+

[edit]
AMD Zen 3+
General information
LaunchedApril 1, 2022; 2 years ago (April 1, 2022)
Designed byAMD
Common manufacturer
CPUID codeFamily 19h
Cache
L1 cache64 KB (per core)
L2 cache512 KB (per core)
L3 cacheUp to 16 MB
Architecture and classification
Technology nodeTSMC N6
Instruction setAMD64 (x86-64)
Physical specifications
Cores
  • 4 to 8
Package
    • Package FP7
    • Package FP7r2
Products, models, variants
Product code names
  • Thin & Light Mobile
    • Rembrandt
    • Rembrandt-R

  • High-End Mobile
    • Rembrandt
    • Rembrandt-R

History
PredecessorZen 3
SuccessorZen 4
Support status
Supported

Zen 3+ is the codename for a refresh of the Zen 3 microarchitecture, which focuses on power efficiency improvements. It was released in April 2022 with the Ryzen 6000 series of mobile processors.

Features and improvements

[edit]

Zen 3+ has 50 new or enhanced power management features over Zen 3, and also provides an adaptive power management framework, as well as new deep sleep states. Altogether, this brings improvements to efficiency both during idle, and when under load, with up to 30% performance-per-watt increase over Zen 3, as well as longer battery life.[66][67]

IPC is identical to that of Zen 3; the performance improvements of Ryzen 6000 over Ryzen 5000 mobile processors stem from it having a higher efficiency (hence more performance in power-constrained form factors like laptops), as well as the increased clock speeds from being built on the smaller TSMC N6 node.[68]

The Rembrandt implementation of Zen 3+ also has support for DDR5 and LPDDR5 memory.

Products

[edit]

Rembrandt

[edit]

On April 1, 2022, AMD released the Ryzen 6000 series of mobile APUs, codenamed Rembrandt. It introduces PCIe 4.0 and DDR5/LPDDR5 for the first time in an APU for the laptop and also introduced RDNA2 integrated graphics to the PC. It is built on TSMC's 6 nm node.[8]

Common features of Ryzen 6000 notebook APUs:

  • Socket: FP7, FP7r2.
  • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Native USB 4 (40Gbps) Ports: 2
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.
Branding and model CPU GPU TDP Release
date
Cores
(threads) 		Clock (GHz) L3 cache
(total) 		Core
config[i] 		Model Clock
(GHz) 		Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 6980HX 8 (16) 3.3 5.0 16 MB 1 × 8 680M 2.4 768:48:8
12 CUs 		3686.4 45 W Jan 4, 2022
[69]
6980HS 35 W
6900HX[a] 4.9 45 W
6900HS[a] 35 W
Ryzen 7 6800H[a] 3.2 4.7 2.2 3379.2 45 W
6800HS[a] 35 W
6800U[a] 2.7 15–28 W
Ryzen 5 6600H[a] 6 (12) 3.3 4.5 1 × 6 660M 1.9 384:24:8
6 CUs 		1459.2 45 W
6600HS[a] 35 W
6600U[a] 2.9 15–28 W
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d e f g h Model also available as PRO version (6650U[70], 6650H[71], 6650HS[72], 6850U[73], 6850H[74], 6850HS[75], 6950H[76], 6950HS[77]), released on April 19, 2022.

Rembrandt-R

[edit]

Rembrandt-R is the codename for a refresh of Rembrandt codenamed processors, released as the Ryzen 7035 series of mobile APUs in January 2023.

Common features of Ryzen 7035 notebook APUs:

  • Socket: FP7, FP7r2.
  • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Native USB 4 (40Gbps) Ports: 0
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.
Branding and model CPU GPU TDP Release
date[78]
Cores
(threads) 		Clock (GHz) L3 cache
(total) 		Core
config[a] 		Model Clock
(GHz) 		Processing
power[b]
(GFLOPS)
Base Boost
Ryzen 7 7735HS 8 (16) 3.2 4.75 16 MB 1 × 8 680M
12 CU 		2.2 3379.2 35–54 W April 30, 2023
7735H
7736U 2.7 4.7 15–28 W January 4, 2023
7735U 4.75 15–30 W
7435HS 3.1 4.5 — 35–54 W 2024[79]
7435H
Ryzen 5 7535HS 6 (12) 3.3 4.55 1 × 6 660M
6 CU 		1.9 1459.2 April 30, 2023
7535H
7535U 2.9 15–30 W January 4, 2023
7235HS 4 (8) 3.2 4.2 8 MB 1 × 4 — 35–53 W 2024[80]
7235H
Ryzen 3 7335U 3.0 4.3 660M
4 CU 		1.8 921.6 15–30 W January 4, 2023
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

References

[edit]
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