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STMicroelectronics

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STMicroelectronics NV
Company typeNaamloze vennootschap (NV)
Euronext Paris: STMPA
NYSE: STM
BIT: STMMI
CAC 40 component
FTSE MIB component
ISINNL0000226223
IndustrySemiconductors
PredecessorSGS Microelettronica
Thomson Semiconductors
Founded1987; 37 years ago (1987)
HeadquartersPlan-les-Ouates, Geneva, Switzerland
Key people
Jean-Marc Chery
(President and CEO)
Nicolas Dufourcq
(Chairman)
ProductsIntegrated circuits for specific applications, memory (including EEPROM), microcontrollers, microprocessors, transistors, smartcards
RevenueIncrease US$17.24 billion (2023)
Increase US$4.611 billion (2023)
Increase US$4.222 billion (2023)
Total assetsIncrease US$24.45 billion (2023)
Total equityIncrease US$16.85 billion (2023)
Number of employees
51,323 (2023)
Websitest.com
Footnotes / references
[1]
STM32 microcontroller made by STMicroelectronics

STMicroelectronics NV (commonly referred to as ST or STMicro) is a European multinational semiconductor contract manufacturing and design company. It is the largest of such companies in Europe. It was founded in 1987 from the merger of two state-owned semiconductor corporations: Thomson Semiconducteurs of France and SGS Microelettronica of Italy. The company is incorporated in the Netherlands and headquartered in Plan-les-Ouates, Switzerland. Its shares are traded on Euronext Paris, the Borsa Italiana and the New York Stock Exchange.[2]

History

[edit]

ST was formed in 1987 by the merger of two government-owned semiconductor companies: Italian SGS Microelettronica (where SGS stands for Società Generale Semiconduttori, "General Semiconductor Company"), and French Thomson Semiconducteurs, the semiconductor arm of Thomson.

SGS Microelettronica originated in 1972 from a previous merger of two companies:

Thomson Semiconducteurs was created in 1982 by the French government's widespread nationalization of industries following the election of socialist François Mitterrand to the presidency. It included:

At the time of the merger of these two companies in 1987, the new corporation was named SGS-THOMSON and was led by chief executive officer Pasquale Pistorio.[3] The company took its current name of STMicroelectronics in May 1998 following Thomson's sale of its shares. After its creation ST was ranked 14th among the top 20 semiconductor suppliers with sales of around US$850 million. The company has participated in the consolidation of the semiconductor industry since its formation, with acquisitions including:

  • In 1989, British company Inmos known for its transputer microprocessors from parent Thorn EMI;
  • In 1994, Canada-based Nortel's semiconductor activities;
  • In 1999, UK, Edinburgh based VLSI-Vision CMOS Image Sensor research & development company, a spin-out of Edinburgh University. Incorporated on 1 January 2000, the company became STMicroelectronics Imaging Division, currently part of the Analog MEMS and Sensors business group;
  • In 2000, WaferScale Integration Inc. (WSI, Fremont, California), a vendor of EPROM and flash memory-based programmable system-chips;[4]
  • In 2002, Alcatel's Microelectronics division, which along with the incorporation of smaller ventures such as UK company, Synad Ltd, helped the company expand into the Wireless-LAN market;
  • In 2007, US-based Genesis Microchip.[5] Genesis Microchip is known for their strength in video processing technology (Faroudja) and has design centres located in Santa Clara, California, Toronto, Taipei City and Bangalore.
4 Field-Programmable Microcontroller Peripheral from Wafer Scale Integration PSD311

On December 8, 1994, the company completed its initial public offering on the Paris and New York stock exchanges. Owner Thomson SA sold its stake in the company in 1998 when the company also listed on the Italian Bourse in Milan. In 2002, Motorola and TSMC joined ST and Philips in a new technology partnership. The Crolles 2 Alliance was created with a new 12" wafer manufacturing facility located in Crolles, France. In 2005, chief executive officer Pasquale Pistorio was succeeded by Carlo Bozotti, who then headed the memory products division and had been with the company’s predecessor since 1977.[3] By 2005, ST was ranked fifth, behind Intel, Samsung, Texas Instruments and Toshiba, but ahead of Infineon, Renesas, NEC, NXP Semiconductors, and Freescale. The company was the largest European semiconductors supplier, ahead of Infineon and NXP.

Early in 2007, NXP Semiconductors (formerly Philips Semiconductors) and Freescale (formerly Motorola Semiconductors) decided to stop their participation in Crolles 2 Alliance. Under the terms of the agreement the Alliance came to an end on December 31, 2007.[6] On May 22, 2007, ST and Intel created a joint venture in the memory application called Numonyx: this new company merged ST and Intel Flash Memory activities. Semiconductor market consolidation continued with ST and NXP announcing on April 10, 2008, the creation of a new joint venture of their mobile activities, with ST owning 80% of the new company and NXP 20%. This joint venture began on August 20, 2008. On February 10, 2009, ST Ericsson, a joint venture bringing together ST-NXP Wireless and Ericsson Mobile Platforms, was established.[7]

ST Ericsson was a multinational manufacturer of wireless products and semiconductors, supplying to mobile device manufacturers.[8] ST-Ericsson was a 50/50 joint venture of STMicroelectronics and Ericsson established on February 3, 2009, and dissolved on August 2, 2013. Headquartered in Geneva, Switzerland, it was a fabless company, outsourcing semiconductor manufacturing to foundry companies.

ST90E40ZL1 - HCMOS MCU with 16Kbytes EPROM, 512 bytes EEPROM, 256 bytes RAM and A/D Converter in a 68-leaded windowed ceramic quad flat pack package

In 2011, ST announced the creation of a joint lab with Sant'Anna School of Advanced Studies. The lab focuses on research and innovation in biorobotics, smart systems and microelectronics.[9] Past collaborations with Sant'Anna School of Advanced Studies included DustBot, a platform that integrated self-navigating "service robots" for waste collection.[9]

In 2018, chief executive Carlo Bozotti was succeeded by Jean-Marc Chery.[10] In 2023, STMicroelectronics partnered with Synopsys to design a working chip on Microsoft Corp’s cloud, marking the first time AI software had been utilized for chip design.[11]

In 2024, ST became the sixth shareholder of Quintauris, a joint company with the goal of standardizing RISC-V ecosystem.[12]

Shareholders

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As of December 31, 2014, the shareholders were:[13]

Manufacturing facilities

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Unlike fabless semiconductor companies, STMicroelectronics owns and operates its own semiconductor wafer fabs. The company owned five 5-inch (200 mm) wafer fabs and 1 12-inch (300 mm) wafer fab in 2006.[citation needed] Most of the production is scaled at 0.18 μm, 0.13 μm, 90 nm and 65 nm (measurements of transistor gate length). STMicroelectronics also owns back-end plants, where silicon dies are assembled and bonded into plastic or ceramic packages.[14]

Major sites include: [citation needed]

Grenoble, France

[edit]

Grenoble is one of the company's most important R&D centres, employing around 4,000 staff. The Polygone site employs 2,200 staff and is one of the historical bases of the company (ex SGS). All the historical wafer fab lines are now closed but the site hosts the headquarters of many divisions (marketing, design, industrialization) and an important R&D center, focused on silicon and software design and fab process development.[15]

The Crolles site hosts a 200 mm (8 in) and a 300 mm (12 in) fab and was originally built as a common R&D center for submicrometre technologies as part of the 1990 Grenoble 92 partnership between SGS-Thomson and CNET, the R&D center of French telecom company France Telecom.[16] The 200 mm (8 in) fab, known as Crolles 1, is the company's first and was built as part of a 1991 partnership between SGS-Thomson and Philips to develop new manufacturing technologies. Crolles 1 was opened on September 9, 1993 by Gérard Longuet, French minister for industry, and Alain Carignon, mayor of Grenoble.

The 300 mm (12 in) fab was inaugurated by French president Jacques Chirac, on February 27, 2003. It includes an R&D center which focuses on developing new nanometric technology processes for 90-nm to 32-nm scale using 300 mm (12 in) wafers and it was developed for The Crolles 2 Alliance. This alliance of STMicroelectronics, TSMC, NXP Semiconductors (formerly Philips semiconductor) and Freescale (formerly Motorola semiconductor) partnered in 2002 to develop the facility and to work together on process development.[17] The technologies developed at the facility were also used by global semiconductor foundry TSMC of Taiwan, allowing TSMC to build the products developed in Crolles on behalf of the Alliance partners who required such foundry capacity. A new fab is under construction since 2015.

Rousset, France

[edit]

Employing around 3,000 staff, Rousset hosts several division headquarters including smartcards, microcontrollers, and EEPROM as well as several R&D centers. Rousset also hosts an 8-inch (200-mm) fab, which was opened on May 15, 2000 by French prime minister Lionel Jospin.[18][19]

The site opened in 1979 as a 100 mm (3.9 in) fab operated by Eurotechnique, a joint venture between Saint-Gobain of France and National Semiconductor of the US. Rousset was sold to Thomson-CSF in 1982 as part of the French government's 1981–82 nationalization of several industries. As part of the nationalisation, a former Thomson plant in the center of Aix-en-Provence operating since the 1960s was closed and staff were transferred to the new Rousset site. The original 100 mm (4 in) fab was upgraded into 130 mm (5 in) and later 150 mm (6 in) fab in 1996. It is now being shut down. The site also has a "Wafer Level Chip Scale Packaging" accreditation for eSIM ICs.[20]

In 1988, a small group of employees from the Thomson Rousset plant (including the director, Marc Lassus) founded a start-up company, Gemalto (formerly known as Gemplus), which became a leader in the smartcard industry.

Tours, France

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Employing 1,500 staff, this site hosts a fab and R&D centers.[21]

Milan, Italy

[edit]

Employing 6,000 staff, the Milan facilities match Grenoble in importance. Agrate Brianza employs around 4,000 staff and is a historical base of the company (ex SGS). The site has several fab lines (including a 300 mm (12 in) fab) and an R&D center.[22] Castelletto, employs 300 to 400 staff and hosts some divisions and R&D centers.

Update-2012: Numonyx JV (with Intel) is acquired by Micron. As such, R2 Fab (Agrate previous R&D 200-mm Fab) is currently a Micron entity

Catania, Italy

[edit]

The Catania plant in Sicily employs 5,000 staff and hosts several R&D centers and divisions, focusing on flash memory technologies as well as two fabs. The plant was launched in 1961 by ATES to supply under licensing to RCA of the US and initially using germanium. The site's two major wafer fabs are a 200 mm (8 in) fab, opened in April 1997 by then-Italian Prime Minister Romano Prodi, and a 300 mm (12 in) fab that has never been completed and which was transferred in its current state to "Numonyx" in 2008. A new manufacturing facility for silicon carbide (SiC) substrates of 150 mm should open here in 2023.[23]

In October 2022, the EU supported STMicroelectronics for the construction of a silicon carbide wafer plant in Catania with €293 million through the Recovery and Resilience Facility to be completed in 2026, and in line with the European Chips Act.[24]

Caserta, Italy

[edit]

STmicro eSIM and SIM production facility for embedded form factor eSIM.[25]

Kirkop, Malta

[edit]

As of 2010, ST employed some 1,500 people in Kirkop, making it the largest private sector employer, and the country's leading exporter.[26]

Singapore

[edit]

In 1970, SGS created its first assembly back-end plant in Singapore, in the area of Toa Payoh. Then in 1981, SGS decided to build a wafer fab in Singapore. The Singapore technical engineers have been trained in Italy and the fab of Ang Mo Kio started to produce its first wafers in 1984. Converted up to 200 mm (8 in) fab, this is now an important 200 mm (8 in) wafer fab of the group. Ang Mo Kio also hosts some design centers.[27] As of 2004, the site employed 6,000 staff.[28]

Update-2012: Numonyx JV (with Intel) is acquired by Micron in 2010. As such, AMK8 Fab (200mm HVM Fab) is currently a Micron entity. AMK5 and AMK6 remains to be STM entities. Update-2019: AMK8 has been reacquired by STM from Micron.

Tunis, Tunisia

[edit]

Application, design and support. about 110 employees. Divisions: MCD

Bouskoura, Morocco

[edit]

Founded in 1979 as a radiofrequency products facility, the Bouskoura site now hosts back-end manufacturing activity, which includes chip testing and packaging.[29] Since 2022 it also features a production line for silicon carbide products that primarily will be used in electric vehicles.[30]

Norrköping, Sweden

[edit]

The Norrköping plant is a wafer fab that, at the start of production in 2021, was the first to produce 200mm (8 in) Silicone Carbide wafers. The wafers are mostly used for SiC power devices.[31]

Other sites

[edit]

Administrative headquarters

[edit]
  • Geneva, Switzerland: Corporate headquarter which hosts most of the ST top management. It totals some hundred of employees.
  • Saint-Genis-Pouilly, France, near Geneva: A few hundred of employees. Headquarters for logistics.
  • Paris: Marketing and support.

Regional headquarters

[edit]

Assembly plants

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  • Malta: In 1981, SGS-Thomson (now STMicroelectronics) built its first assembly plant in Malta. STMicroelectronics is, as of 2008, the largest private employer on the island, employing around 1,800 people.
  • Muar, Malaysia: around 4000 employees. This site was built in 1974 by Thomson and is now an assembly plant.
  • Shenzhen, Guangdong province, China: In 1994, ST and the Shenzhen Electronics Group signed a partnership to construct and jointly operate an assembly plant (ST has majority with 60%). The plant is located in Futian Free Trade Zone and became operational in 1996. It has around 3,300 employees. A new assembly plant is built in Longgang since 2008, and closed up till 2014. The R&D, design, sales and marketing office is located in the Hi-tech industrial park in Nanshan, Shenzhen.
  • Calamba in the province of Laguna, Philippines: In 2008, ST acquired this plant from NXP Semiconductors. Initially as part of joint venture with NXP but later acquired the whole share turning it into a full-fledged STMicroelectronics Assembly and Testing plant. Currently it employs 2,000 employees.

Design centers

[edit]
  • Cairo, Egypt: Hardware and software design center, started in 2020, with 50 employees.
  • Rabat, Morocco: A design center that employs 160 people.
  • Naples, Italy: A design center employing 300 people.
  • Lecce, Italy: HW & SW Design Center which hosts 20 researchers in the Advanced System Technology group.
  • Ang Mo Kio, Singapore: In 1970, SGS created its first assembly back-end plant in Singapore, in the area of Toa Payoh. Then in 1981, SGS decided to build a wafer fab in Singapore. The Singapore technical engineers have been trained in Italy and the fab of Ang Mo Kio started to produce its first wafers in 1984. Converted up to 8 inch (200 mm) fab, this is now an important 8 inch (200 mm) wafer fab of the ST group. Ang Mo Kio also hosts design centers for various groups.
  • Greater Noida, India: The Noida site was launched in 1992 to conduct software engineering activities. A silicon design center was inaugurated on February 14, 1995. With 120 employees, it was the largest design center of the company outside Europe at the time. In 2006, the site was shifted to Greater Noida for further expansion. The site hosts mainly design teams. It is now primarily involved with the design of home video products (Set-Top Box, DVD), GPS and Wireless LAN chips, and accompanying software. Worldwide Data center support is also transferred to Greater Noida in 2004. The employee strength in Greater Noida is around 2000. This also includes employees of ST-Ericsson.
  • Santa Clara, California, (Silicon Valley), United States: 120 staff in marketing, design and applications.
  • La Jolla, California, (San Diego, United States): 80 staff in design and applications.
  • Lancaster, Pennsylvania, United States: Application, support, and marketing.
  • Prague, Czech Republic: 100 to 200 employees. Application, design and support.
  • Tunis, Tunisia: 110 employees. Application, design and support.
  • Sophia Antipolis, near Nice, France: Design center with a few hundred employees.
  • Edinburgh, Scotland: 200 staff focused in the field of imaging and photon detection.
  • Ottawa, Ontario, Canada: In 1993, SGS-Thomson purchased the semiconductor activities of Nortel which owned in Ottawa an R&D center and a fab. The fab was closed in 2000, however, a design, R&D centre and sales office is operating in the city.
  • Toronto, Ontario, Canada: HW & SW Design Center primarily involved with the design of video processor ICs as part of ST's TVM Division.
  • Bangalore, India: HW and SW design center employing more than 250 people (Including the employees of ST Ericsson and Genesis Microchip).
  • Zaventem, Belgium: 100 employees. Design & Application Center.
  • Helsinki, Finland: Design Center.
  • Turku, Finland: Design Center.
  • Oulu, Finland: Design Center.
  • Tampere, Finland: Design Center.
  • Longmont, Colorado United States: Design Center.
  • Graz, Austria: NFC Competence Center.[33]
  • Pisa, Italy: A design center employing more than 50 people. R&D, analog and digital design.

Closing sites

[edit]

The Phoenix, Arizona 8 inch (200 mm) fab, the Carrollton, Texas 6 inch (150 mm) fab, and the Ain Sebaa, Morocco fab are beginning rampdown plans, and are destined to close by 2010.[34]

The Casablanca, Morocco site consists of two assembly parts (Bouskoura and Aïn Sebaâ) and totals around 4000 employees. It was opened in the 1960s by Thomson.

The Bristol, United Kingdom site employing well over 300 at its peak (in 2001/2) but was ramped down to approx. 150 employees at close by early 2014.

The Ottawa, Ontario, Canada plant (approx. 450 employees) will close down by 2013 end.[35]

Closed sites

[edit]
  • Rennes, France hosted a 6-inch (150 mm) fab and was closed in 2004
  • Rancho Bernardo, California, a 4-inch (100 mm) fab created by Nortel and purchased by SGS-Thomson in 1994, after which it was converted into a 6-inch (150 mm) fab in 1996.
  • SGS's first presence in the US was a sales office based in Phoenix in the early 1980s. Later, under SGS-Thomson, an 8-inch (200 mm) fab was completed in Phoenix in 1995. The company's second 8" fab after Crolles 1, the site was first dedicated to producing microprocessors for Cyrix. On July 10, 2007, ST said that it would close this site, and in July 2010 the shell of the Phoenix PF1 FAB was bought by Western Digital Corporation.[34]
  • The Carrollton, Texas site was built in 1969 by Mostek, an American company founded by former employees of Texas Instruments. In 1979, Mostek was acquired by United Technologies, which sold it to Thomson Semiconducteurs in 1985. Initially equipped with a 4-inch (100 mm) fab, it was converted into a 6-inch (150 mm) fab in 1988. The Colorado Springs activities of British company INMOS were transferred to Carrollton in 1989 following its acquisition by SGS Thomson. Since then the site has been refocused to wafer testing. On July 10, 2007, ST announced it would close this fab, and it was finally closed in 2010.[34]
  • Bristol, UK This R&D site housed the British company Inmos, which in 1978 began development of the famous Transputer microprocessor. The site was acquired with Inmos in 1989, and was primarily involved with the design of home video and entertainment products (e.g. Set-Top Box), GPS chips, and accompanying software. At its peak the site employed more than 250 employees. The site officially closed on March 31, 2014.[36]

Future locations

[edit]
  • On August 8, 2007, ST bought Nokia's microchip development team and plans to invest heavily in development of cellular ASIC applications. The purchase included Nokia's ASIC team in Southwood (UK) and the company plans several sites in Finland.[37][38][39]
  • In June 2023, ST announced its partnership with GlobalFoundries to build a new factory in Crolles, France.[40]

See also

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References

[edit]
  1. ^ "2023 Annual Report (Form 20-F)". U.S. Securities and Exchange Commission. 22 February 2024. Retrieved 22 February 2024.
  2. ^ "Stock data - STMicroelectronics". STMicroelectronics.
  3. ^ a b Faucon, Benoit; Newswires, Gren Manueldow Jones (16 March 2004). "STMicro Names CEO to Succeed Retiring Pistorio". Wall Street Journal. Retrieved 7 December 2023.
  4. ^ Clarke, Peter (2000-07-28). "STMicroelectronics buys WaferScale Integration". EE Times. Retrieved 2020-12-09.
  5. ^ "STMicroelectronics To Acquire Genesis Microchip". Archived from the original on 2018-06-27. Retrieved 2018-06-27.
  6. ^ "Archived copy". Archived from the original on January 1, 2014. Retrieved July 15, 2013.{{cite web}}: CS1 maint: archived copy as title (link)
  7. ^ glen (2009-02-17). "CSR-SiRF Merger Pairs Struggling Bluetooth and GPS Powerhouses - and Shows Handset Platform Dominance". Inside GNSS. Archived from the original on 2019-05-27. Retrieved 2019-05-27.
  8. ^ "About us – General Information – ST-Ericsson". stericsson.com. Archived from the original on 23 December 2010. Retrieved 24 February 2011.
  9. ^ a b "ST Micro opens lab for humanoid robot research | EDN". Archived from the original on 2013-01-21. Retrieved 2011-07-27.
  10. ^ "ST Micro: CEO Bozotti Passes the Keys to the Ferrari". Barron's. Retrieved 7 December 2023.
  11. ^ Stephen Nellis. "STMicro leans on AI, cloud as chip designs become more complex". reuters. Retrieved 7 December 2023.
  12. ^ Mancini, Giovanna (2024-11-08). "Quintauris, la start up europea che abbatte i costi dei microchip". Il Sole 24 ORE (in Italian). Retrieved 2024-11-10.
  13. ^ "2014 Annual Report". STMicroelectronics. 26 March 2015. Archived from the original on 10 April 2020. Retrieved 20 February 2016.
  14. ^ "Company Information - STMicroelectronics". STMicroelectronics. Archived from the original on 2013-02-03. Retrieved 2011-05-04. ST operates a worldwide network of front-end (wafer fabrication) and back-end (assembly and test and packaging) plants
  15. ^ "STMicroelectronics celebrates "Nano2017" R&D program at Crolles facility". powersystemsdesign.com. 2013-07-24. Retrieved 2023-11-03.
  16. ^ "The Controversy over Offshoring: Power, Resistance and Translations in the French Semiconductor Industry". strategie-aims.com. Retrieved 2023-11-03.
  17. ^ "Crolles2 Alliance Facility Expansion, Crolles". semiconductor-technology.com. Retrieved 2023-11-03.
  18. ^ "ST's Manufacturing Strategy – the Key to Business Success". eletimes.com. 2023-04-18. Retrieved 2023-11-03.
  19. ^ "STMicroelectronics Inaugurates New 8 in.-200mm- Wafer Fab in Rousset". wirelessdesignonline.com. Retrieved 2023-11-03.
  20. ^ "ST Offers eSIMs at Wafer Level". eetimes.com. 2018-06-27. Retrieved 2023-11-07.
  21. ^ "STMicroelectronics and Leti Develop GaN-on-Silicon Technology for Power Conversion Applications". leti-cea.com. 2018-08-24. Retrieved 2023-11-07.
  22. ^ "STMicro and Politecnico di Milano expand R&D capabilities". evertiq.com. 2021-12-15. Retrieved 2023-11-07.
  23. ^ Emilio, Maurizio Di Paolo (2022-10-05). "SiC Substrate Manufacturing Facility". Power Electronics News. Archived from the original on 2022-10-05. Retrieved 2022-10-06.
  24. ^ EU Press corner (2022-10-05). "State aid: Commission approves €292.5 million Italian measure under Recovery and Resilience Facility to support STMicroelectronics in construction of a plant in the semiconductor value chain". European Commission - European Commission. Archived from the original on 2020-08-25. Retrieved 2023-03-28.
  25. ^ "What Is an eSIM? The Pros, Cons, and Seeming Inevitability of Embedded SIM ICs". 2018-07-16. Retrieved 2023-11-07.
  26. ^ "ST Microelectronics announces investment in Malta". timesofmalta.com. 29 June 2010. Archived from the original on 2010-07-02. Retrieved 2013-07-10.
  27. ^ "STMicroelectronics establishes world's first Lab-in-Fab in Singapore". semimedia.cc. 2020-10-30. Retrieved 2023-11-14.
  28. ^ "STMicro to continue investing in Singapore technology park". siliconsemiconductor.net. 2004-12-02. Retrieved 2023-11-14.
  29. ^ "STMicroelectronics‌ ‌Bouskoura‌ ‌Launches‌ ‌Expansion,‌ ‌Eying‌ ‌Top‌ ‌Spot‌ ‌in‌ ‌Industry‌ ‌4.0‌". moroccoworldnews.com. 2021-07-30. Retrieved 2023-11-14.
  30. ^ "STMicroelectronics Opens New Plant for Electric Car Parts in Morocco". moroccoworldnews.com. 2022-06-08. Retrieved 2023-11-14.
  31. ^ "STMicroelectronics Begins Producing 200mm Silicon Carbide Wafers". eepower.com. 2021-08-12. Retrieved 2023-11-14.
  32. ^ ChinaTechNews. "STMicroelectronics Launches New China Headquarters In Shanghai Archived 2016-12-20 at the Wayback Machine." Apr 11, 2008. Retrieved Dec 7, 2016.
  33. ^ AMS sells NFC and RFID business to STMicroelectronics – NFC World Archived 2018-10-23 at the Wayback Machine. Retrieved on 2018-10-23.
  34. ^ a b c "ST | STMicroelectronics Outlines Next Steps to Improve Cost Structure | C2542C". Archived from the original on July 13, 2007. Retrieved July 11, 2007.
  35. ^ STMicroelectronics to close Ottawa plant - Archives - Ottawa Business Journal. Obj.ca (2001-05-31). Retrieved on 2013-12-08.
  36. ^ STMicroelectronics to close Aztec West Business Park site Archived July 13, 2013, at the Wayback Machine BBC News
  37. ^ "ST | Nokia and STMicroelectronics plan deeper ties in 3G technology development | C2547C". Archived from the original on August 16, 2007. Retrieved August 14, 2007.
  38. ^ "About us". Nokia.com. 4 December 2013. Retrieved 5 July 2016.
  39. ^ "Nokia lines up chip transfer to ST - Electronics Weekly". Electronicsweekly.com. 8 August 2007. Archived from the original on 27 September 2011. Retrieved 5 July 2016.
  40. ^ "France to provide 2.9 billion euros in aid for new STMicro/GlobalFoundries factory". reuters.com. 2023-06-05. Retrieved 2024-04-03.
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