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File:XCGPU-heatspreader.jpg

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Description
English: An illustration of the system on a chip (SoC) unit inside Microsoft's game console Xbox 360 S. This part is called XCGPU.

It's a multi chip module, consisting of two chips, but they are all hidden under the heatspreader.

The chips of this specimen was manufactured by Global Foundries in Singapore but the complete device was packaged by IBM at their plant in Bromont, Canada. It was manufactured sometime in 2010.

Inspiration for the image comes from pictures at GiggleHD.com
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Source Own work
Author Henriok

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11 January 2013

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current19:01, 11 January 2013Thumbnail for version as of 19:01, 11 January 20131,488 × 1,488 (876 KB)HenriokUser created page with UploadWizard

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