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File:FOWLP type.png

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Summary

Description
中文(中国大陆):扇出晶圆级封装工艺分类:面朝下,先芯片;面朝上,先芯片;面朝下,后芯片;
Date
Source Own work
Author 思考的苇丛

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Captions

Fan-out wafel level package type

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depicts

25 March 2024

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Date/TimeThumbnailDimensionsUserComment
current13:36, 25 March 2024Thumbnail for version as of 13:36, 25 March 20241,874 × 1,412 (181 KB)思考的苇丛Uploaded own work with UploadWizard

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